Agilent Technologies Introduces High-Speed, 870 Nanometer Infrared Emitter


August 25, 2004... Device Offers Radiant Power Up to 180 mW/sr for Higher Performance, Cost Savings in Consumer, Industrial Products

PALO ALTO, California USA -- Agilent Technologies Inc. (NYSE: A) today introduced a new high-speed LED infrared (IR) emitter. The new product, from Agilents Semiconductor Products Group, uses the companys high-power aluminum gallium arsenide ( AlGaAs) LED technology, which has been optimized for high radiant intensity, speed and low forward voltage.

The Agilent HSDL-4261 IR emitter provides manufacturers with a low-cost illumination source suitable for a broad range of applications, from communication devices and IR LANs to consumer products such as optical mice, IR headphones, microphones and keyboards.

The HSDL-4261 emitter features 15 ns rise time and 45 ns fall time (10 percent to 90 percent), with intensities of up to 180 mW/sr (typical) at ILED=100 mA at a 26-degree viewing angle. It operates At the 870 nm optical wavelength and is supplied in an industry-standard 5 mm (T-1 3/4) form-factor package.

The Agilent IR emitter is built with iron lead frames that dissipate power during over a wide range of currents. The forward voltage is a low 1.40 volts at 20 mA, which, in some applications, allows two or more of the emitters to be connected in Series without exceeding the supply-voltage capability.

US Pricing and Availability

The Agilent HSDL-4261 is priced at $0.12 each in moderate volumes and is available now through Agilents direct sales channel and worldwide distribution partners.

Further information about Agilents infrared products is available at

About Agilent Technologies

Agilent Technologies Inc. (NYSE: A) is a global technology leader in communications, electronics, life sciences and chemical analysis. The companys 28,000 employees serve customers in more than 110 countries. Agilent had net revenue of $6.1 billion in fiscal year 2003. Information About Agilent is available on the Web at

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HDI
Structures
Type of
Micro vias
Mass
Production
Small-Middle
Batch
Prototype Available
1+N+1 Blind vias Yes Yes Yes 4 layers+
2+N+2 Blind/Buried
staggered vias
Yes Yes Yes 6 layers+
2+N+2 Blind/Buried
stacked vias
Yes Yes Yes 6 layers+
3+N+3 Blind/Buried
staggered vias
/ Yes Yes 8 layers+
3+N+3 Blind/Buried
stacked vias
/ / Yes 8 layers+

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Feature Capability
Quality Grade Standard IPC 2
Number of Layers 4 - 24layers
Order Quantity 1pc - 10000+pcs
Build Time 2days - 5weeks
Material FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination
Board Size Min 6*6mm | Max 457*610mm
Board Thickness 0.4mm - 3.0mm
Copper Weight (Finished) 0.5oz - 2.0oz
Min Tracing/Spacing 2.5mil/2.5mil
Solder Mask Sides As per the file
Solder Mask Color Green, White, Blue, Black, Red, Yellow
Silkscreen Sides As per the file
Silkscreen Color White, Black, Yellow
Surface Finish HASL - Hot Air Solder Leveling 
Lead Free HASL - RoHS 
ENIG - Electroless Nickle/Immersion Gold - RoHS 
Immersion Silver - RoHS 
Immersion Tin - RoHS 
OSP - Organic Solderability Preservatives - RoHS
Min Annular Ring 4mil, 3mil - laser drill
Min Drilling Hole Diameter 6mil, 4mil - laser drill
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Other Techniques Flex-rigid combination 
Via In Pad 
Buried Capacitor (only for Prototype PCB total area ≤1m²)



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