Low cost, high reliability, rushing to the beach, Lianjing Optoelectronics, no packaging technology, first machine

[Text / high-tech LED reporter Wang Cairong] In recent years, due to the omission of some packaging links, chip-level packaging technology with small size, high brightness, good concentration of light source, high reliability and flexible optical control is gradually becoming more and more Enter the industry vision.

Lianjing Optoelectronics Co., Ltd. is a Taiwanese semiconductor foundry giant Lianhua Electronics Investment Subsidiary. It is a technology and quality oriented LED packaging factory. Its main focus is on high-power, high-quality LED packaging and light source module product design, research and development, production and sales, and can provide customers with customized LED lighting application solutions.

It is understood that Lianjing Optoelectronics has taken the lead in adopting the Chip Scale Package (CSP), and launched the Mercury CSP1515 series of high-power chip-scale package products in 2013. It is the first LED package in Taiwan to announce the production of CSP (ChipScale Package) products. Big factory. In addition, it has formed a relatively complete product system with the current series of Venus 3535, Jupiter 5050 and COB.

It is an indisputable fact that with the gradual rise of many domestic LED packaging factories in recent years, the advantages of Taiwan packaging manufacturers in traditional packaging technology and cost control are gradually being lost. Therefore, the potential chip-level packaging is increasingly being used by Taiwanese packaging manufacturers. It is regarded as the killer of the domestic market, and Lianjing Optoelectronics has begun to take the lead in the market with its leading technology without packaging.

"From the perspective of LED package cost structure, the most important ones are LED chips, then phosphors, silica gels and gold wires. The biggest difference between the chip-level packaging of Lianjing Optoelectronics and the current packaging products on the market is that, in addition to chips, The materials used in phosphors and silica gel can be used most conveniently, because our products have the smallest package size, which is the most prominent advantage.” Dr. Cai Jialun, Associate of Marketing and Business Department of Lianjing Optoelectronics, accepted the reporter of “High-tech LED” Said in an interview.

Dr. Cai Jialun introduced that the size of chip-scale package products is much larger than the size of chips (LED chips), so it is called chip-level package. At present, the Mercury CSP1515 series products launched by Lianjing Optoelectronics are only 1.5 mm x 1.5 mm in size, which is much smaller than the traditional 3535, 3030, 2835 and other products, but the single one can do it. 3.6W. “In the production process, when the phosphor and silica gel are fixed, because the volume is small and the unit output is greatly increased, the overall cost will be effectively controlled after the flattening.”

In addition, under the premise of effective cost control, high reliability and high cost performance are another major advantages of Lianjing Optoelectronics chip-level packaging products.

"Lianjing Optoelectronics' CSP products use flip-chips, which have the characteristics of low voltage, and do not need to be wired. Therefore, the packaged products produced will not have the problem of gold wire breakage before, and they use metal solid crystal. It has excellent advantages in heat conduction." Dr. Cai Jialun told reporters that the traditional packaged devices use silver glue, most of which are polymer materials, the thermal conductivity is not very good, and the metal solid crystal can solve the heat dissipation well. The problem is to further increase the reliability of the product.

In addition to the Mercury CSP 1515 series launched in 2013, the CSP 1515 RGBA colored light series and the CRI>95 ultra-high-profile cold and warm white LEDs have also entered mass production.

Dr. Cai Jialun also revealed to reporters that Lianjing Optoelectronics has recently introduced a smaller chip size package CSP1008. Its size is reduced to 1.0mmx 0.8mm, and a single high-efficiency LED that can achieve 1.5W from 0.7W.

“The CSP 1515 series is generally used in outdoor, industrial or high wattage products, while the CSP 1008 is mainly aimed at ultra-thin direct-lit backlights, xenon lamps or indoor lighting products. Currently, the specifications may be close to the traditional 1W. For example, the 3030 series products.” Dr. Cai Jialun said that compared with the domestic 3030 products, the CSP 1008 series can at least increase the cost performance of more than 35%, and the CSP 1515 series is the best solution for the current 1-3W LED.

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