The automated production of microwave components and modules has been in use for many years. These systems have enabled a wide range of applications, especially in large-scale point-to-point microwave links. However, when it comes to the millimeter-wave band around 60 GHz, automation is still not fully realized. This lack of automation poses significant challenges for mass production and cost reduction.
Developing millimeter-wave modules often requires integrating various VHF monolithic devices, which demands extensive expertise. Engineers face difficulties in designing module packaging, adapting components, and strategically adding absorbing materials to ensure optimal performance. These challenges make the process both time-consuming and expensive.
Most manufacturers in the millimeter-wave industry are small-scale, focusing on niche markets such as military, aerospace, and research. The complexity of packaging and manufacturing limits the widespread deployment of these systems, making it hard to reduce costs, size, and weight effectively.
With the growing demand for high-quality video streaming—both mobile and broadcast—and the need for HD CCTV, there's increasing interest in the vast bandwidth available at millimeter-wave frequencies. For instance, uncompressed HD video requires about 1.4 Gbps of bandwidth. Additionally, with the rollout of 3G LTE services, each requiring 100 Mbps backhaul capacity, the 60 GHz band offers up to 7 GHz of usable bandwidth.
Beyond communication, the rich bandwidth in ultra-high frequency bands also enhances radar and imaging systems. For example, FMCW radars benefit from wider sweep bandwidths, improving target resolution. These radars are now being used in non-military applications like adaptive cruise control and lane change assistance, operating at 77 and 79 GHz.
New scanning systems for detecting hidden weapons and explosives also rely on wide bandwidths in the millimeter-wave range. Active systems use radar-like sweeping methods, while passive systems require high sensitivity and gain, especially in W-band (around 100 GHz) and above 20 GHz.
[Image: MMIC for 60 GHz and higher frequency applications]
Packaging remains a major challenge in millimeter-wave technology. Most microwave and millimeter-wave devices are enclosed in metal casings or coated enclosures that form a cavity for mounting MMIC chips. These enclosures protect the internal components from environmental factors and electromagnetic interference. However, they are often too large, heavy, and costly for certain applications.
For example, airborne systems designed to provide real-time images in low-visibility conditions—such as during dust storms or poor weather—require compact, lightweight millimeter-wave assemblies. Similar requirements apply to imaging systems on manned aircraft.
Microwave circuits inherently radiate energy, and even bond wires and chip structures can act as radiation sources. At millimeter-wave frequencies, where wavelengths are comparable to chip sizes, electromagnetic effects that were negligible at lower frequencies become dominant, significantly affecting system performance.
Radiated energy can couple into other parts of the circuit, causing unwanted behavior or even complete failure. Cavity structures and resonances in non-planar circuits are common issues. These problems make it difficult to manufacture reliable and stable millimeter-wave equipment.
One approach to mitigate these issues is the flip-chip package, where the chip is bonded directly to the substrate. Substrates made of quartz, ceramic, or high-frequency organic materials are commonly used. Solder bumps serve as low-loss interconnects, but the proximity of the non-conductive substrate can still impact high-frequency performance.
Moreover, without a thermally efficient substrate, flip-chip packages cannot achieve full-area contact. Managing heat dissipation becomes challenging, and thermal expansion mismatches between the chip and substrate may lead to reliability issues over time.
Solutions like filling non-conductive materials between the chip and substrate often compromise microwave performance. Additionally, most MMIC chips are planar, making it difficult to create reliable low-loss connections. The inability to inspect or rework flip-chip assemblies further limits their applicability in certain millimeter-wave systems.
Another solution is to design smaller cavities to prevent resonance at the operating frequency. However, higher-order resonant modes can still interfere with performance. Even with this method, absorbing materials are essential. At 60 GHz and above, creating a cavity small enough to avoid resonance is impractical, especially when considering cost-effective automated assembly processes.
Power Meter Backlit
WARNING!
Do not plug two or more meters together!
IMPORTANT
Don't plug in an appliance where the load
exceeds 16 Amp. Always ensure the plug of any appliance is fully
inserted into the meter outlet. If cleaning of the meter is required,
remove from mains power and wipe meter with a dry cloth.
KEYBOARD DEFINITION
1). SET: Set price with button UP.
2). MODE: Exchange display state.
3). UP: Set price combined with button SET.
GENERAL FEATURES
1).Display line power.
2).Display and memory accumulative total power quantity.
3).Display and memory total power charge of price.
THE DATA DISPLAY
Press MODE button the data displays as follows:
W →KWh →PRICE →COST/KWH
↑_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _↓
1). Plug in socket and power on, the meter will display real power.
2). Press MODE button once again and release, the meter will display accumulative KWh.
3). Press MODE button once again and release, the meter will display total power charge.
4). Press MODE button once again and release, the meter will display COST/KWH.
SETTING PRICE OF COST/KWH
1). Press SET button during display COST/KWH,the first digital COST/KWH flash, press UP button to set it.
2). Press SET button once again and release, the second digital COST/KWH flash, press UP button to set it.
3). Press SET button once again and release, the third COST/KWH flash, press UP button to set it.
4). Press SET button once again and release, the fourth COST/KWH flash, press UP button to set it.
5). Press SET button once again and release, the radix point COST/KWH flash, press UP button to set it.
DATA CLEAR
Press and hold MODE button for 5 seconds will clear KWH,PRICE and COST/KWH data.
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