China Wheel (KINIK) will launch the latest Eletroplated Diamond Wire patent technology at SEMICON International Semiconductor Show 2012, which will more effectively solve the slicing problem of the most critical material high-hardness sapphire substrate (Sapphire) upstream of LED. In 2013, it met more than half of the demand in the Taiwanese market.
The sapphire substrate (Sapphire) is still the most critical material for upstream use of LEDs. As the demand for high-power LEDs increases, the demand for sapphire substrates is gradually converted to large sizes. The sapphire substrate is characterized by its high hardness and hardness. In the current slicing process, the Eletroplated Diamond Wire is used for multi-wire wire sawing. According to statistics, the current demand for electroplated diamond wire in Taiwan's sapphire slicing industry is about 5,000km.
Multi-wire wire saw cutting is a processing method for cutting semiconductors, crystals, various single crystals, magnetic materials, precision ceramics, and other hard and brittle materials. Free abrasive wire saws are currently widely used in semiconductor and solar tantalum wafer slicing processes, which use steel wire to drive free abrasive (abrasive + liquid) to remove material, but due to abrasive waste after free abrasive wire saw use, There are environmental protection problems that need to be recycled, and the processing efficiency is low, so the development of fixed abrasive wire saws has become an inevitable trend in the industry.
China Grinding Wheel introduces the latest patented electroplated diamond line technology, which is used to coat the middle layer on the core line and uniformly embed the abrasive material, which can effectively avoid the problem of abrasive accumulation in general electroplating deposition; subsequent plating of metal protective layer to cover and fix The abrasive material can hold the abrasive more stably, thereby increasing the service life and processing efficiency of the wire saw. At the same time, the metal protective layer on the surface of the abrasive can play a buffer and protect the surface to improve the quality of the cut surface.
The sapphire substrate (Sapphire) is still the most critical material for upstream use of LEDs. As the demand for high-power LEDs increases, the demand for sapphire substrates is gradually converted to large sizes. The sapphire substrate is characterized by its high hardness and hardness. In the current slicing process, the Eletroplated Diamond Wire is used for multi-wire wire sawing. According to statistics, the current demand for electroplated diamond wire in Taiwan's sapphire slicing industry is about 5,000km.
Multi-wire wire saw cutting is a processing method for cutting semiconductors, crystals, various single crystals, magnetic materials, precision ceramics, and other hard and brittle materials. Free abrasive wire saws are currently widely used in semiconductor and solar tantalum wafer slicing processes, which use steel wire to drive free abrasive (abrasive + liquid) to remove material, but due to abrasive waste after free abrasive wire saw use, There are environmental protection problems that need to be recycled, and the processing efficiency is low, so the development of fixed abrasive wire saws has become an inevitable trend in the industry.
China Grinding Wheel introduces the latest patented electroplated diamond line technology, which is used to coat the middle layer on the core line and uniformly embed the abrasive material, which can effectively avoid the problem of abrasive accumulation in general electroplating deposition; subsequent plating of metal protective layer to cover and fix The abrasive material can hold the abrasive more stably, thereby increasing the service life and processing efficiency of the wire saw. At the same time, the metal protective layer on the surface of the abrasive can play a buffer and protect the surface to improve the quality of the cut surface.
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